Dual in-line package
A dual in-line package is one way of making microchips and other integrated circuits. The circuit is put inside of a container made out of materials such as plastic or ceramic. All the wires of the circuit are connected to metal pins, and they stick out of the package on two sides. This way the circuit is able to be used from inside the package.
Things can also be put in a dual in-line package that are not integrated circuits. A DIP switch is one example of this, where there are switches on top of the package instead of a circuit inside.
Dual In-line Package Media
EPROM ICs in 0.6" wide ceramic DIP40W, DIP32W, DIP28W, DIP24W packages, also known as CDIP (Ceramic DIP)
Eight-contact DIP switch with 0.3" wide 16-pin (DIP16N) footprint
An operating prototyped circuit on a solderless breadboard incorporating four DIP ICs, a DIP LED bargraph display (upper left), and a DIP 7-segment LED display (lower left)
Breadboard prototype: Ultrasonic microphone preamp build with SMD-parts soldered to DIP and SIP breakout boards
Side view of a dual in-line package (DIP) IC
Dual in-line (DIP) integrated circuit metal tape base with contacts
Several PDIPs and CERDIPs. The large CERDIP in the foreground is an NEC 8080AF (Intel 8080-compatible) microprocessor.
Package sample for single in-line package (SIP or SIL) devices
A Rockwell 6502-based microcontroller in a QIP
