List of Xeon microprocessors (14 nm and smaller)

The following is a partial list of Intel Xeon microprocessors. It includes the processors built with a 14 nm or smaller architecture.

Intel Xeon E5-1620, top and bottom

Broadwell-based Xeons (14 nm)

"Broadwell DE"

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading, Turbo Boost (except D-1518, D-1529), AES-NI, Smart Cache, ECC memory.
SoC peripherals include 8× USB (4× 2.0, 4× 3.0), 6× SATA, 2× Integrated 10 GbE LAN, UART, GPIO, and 32 lanes of PCI Express (8× 2.0, 24× 3.0), in ×16, ×8 and ×4 configurations.
Support for up to four DIMMs of DDR4 or DDR3L memory per CPU socket.

Xeon D-1500 series (1P, SoC)

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Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

"Hewitt Lake"

Xeon D-1600 series (1P, SoC)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

"Broadwell H"

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, ECC memory.
Support for up to four DIMMs of DDR3L memory per CPU socket.

Xeon E3-1200 v4 series (1P)

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Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)

"Broadwell EP"

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading (except E5-2603v4, 2609v4 and 4627v4), Turbo Boost 2.0 (except E5-1603v4, 1607v4, 2603v4, 2609v4 and 4610v4), AES-NI, Smart Cache.
Transistors: Up to 10 cores: 3.20 billion, Up to 15 cores: 4.70 billion, Up to 24 cores: 7.20 billion
Die size: Up to 10 cores: 246 mm², Up to 15 cores: 306 mm², Up to 24 cores: 456 mm²
Support for up to twelve DIMMs of DDR4 memory per CPU socket.

Xeon E5-1600 v4 series (1P)

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Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Xeon E5-2600 v4 series (2P)

Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Xeon E5-4600 v4 series (4P)

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Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

"Broadwell EX"

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost 2.0, AES-NI, Smart Cache.
Support for up to 12 DIMMs of DDR4 memory per CPU socket.

Xeon E7-4800 v4 series (4P)

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Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Xeon E7-8800 v4 series (8P)

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Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Skylake-based Xeons

"Skylake-D" (14 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX2, AVX-512, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, TSX-NI, Intel MPX, Smart Cache, ECC memory.
SoC peripherals include 24× USB (10× 3.0, 14× 2.0), 14× SATA 3.0, 4× Integrated 10 GbE LAN (except D-2191), UART, GPIO, and 32 lanes of PCI Express 3.0 in ×16, ×8 and ×4 configurations.
Support for up to 8 DIMMs of DDR4 memory, up to 64 GB per DIMM (512 GB).
I (such as D-2161I): Integrated Intel Ethernet
T (such as D-2183T): high temperature support or extended reliability offerings
N (such as D-2187NT): Intel Ethernet and Intel QuickAssist Technology^[1]
Package size: 42.5 × 55 mm

Xeon D-21xx (uniprocessor, SoC)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

"Skylake-S" (14 nm)

Xeon E3-12xx v5 (uniprocessor)

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Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)

"Skylake-H" (14 nm)

Xeon E3-15xx v5 (uniprocessor)

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Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)

"Skylake-W" (14 nm)

Xeon W-21xx (uniprocessor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, FMA3, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Turbo Boost (excluding W-2102 and W-2104), Hyper-threading (excluding W-2102 and W-2104), AES-NI, Intel TSX-NI, Smart Cache.
PCI Express lanes: 48
Supports up to 8 DIMMs of DDR4 memory, maximum 512 GB.

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Xeon W-31xx (uniprocessor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, FMA3, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Intel TSX-NI, Smart Cache.
PCI Express lanes: 48
Supports up to 12 DIMMs of DDR4 memory, maximum 512 GB.

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

"Skylake-SP" (14 nm) Scalable Performance

Support for up to 12 DIMMs of DDR4 memory per CPU socket
Xeon Platinum supports up to eight sockets; Xeon Gold supports up to four sockets; Xeon Silver and Bronze support up to two sockets
Xeon Platinum, Gold 61XX, and Gold 5122 have two AVX-512 FMA units per core; Xeon Gold 51XX (except 5122), Silver, and Bronze have a single AVX-512 FMA unit per core
-F: integrated OmniPath fabric
-M: 1536 GB RAM per socket vs 768 GB for non-M SKUs
-P: integrated FPGA
-T: High thermal-case and extended reliability

Xeon Bronze and Silver (dual processor)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Xeon Gold (quad processor)

Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Xeon Platinum (octa processor)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Kaby Lake-based Xeons

"Kaby Lake-S" (14 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, BMI1 (Bit Manipulation Instructions1), BMI2, MPX, SGX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel vPro, Intel VT-x, Intel VT-d, Hyper-threading (except E3-1220 v6, E3-1225 v6), Turbo Boost 2.0, AES-NI, Smart Cache, TSX-NI, ECC memory

Xeon E3-12xx v6 (uniprocessor)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)

"Kaby Lake-H" (14 nm)

Xeon E3-15xx v6 (uniprocessor)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)

Coffee Lake-based Xeons

"Coffee Lake-S WS" (14 nm)

Xeon E-2xxx (uniprocessor)

Xeon E-2x₁x₂x₃: x₁ represents the generation. x₃ represents the number of cores.
No suffix letter: without integrated GPU
-G: with integrated GPU
-M: BGA mobile processor
-L: low power
-E: embedded

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Model number	sSpec number	Cores (threads)	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)

"Coffee Lake-H" (14 nm)

Xeon E-2xxxM (uniprocessor)

Xeon E-2186M & 2286M support Intel Thermal Velocity Boost.

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Model number	sSpec number	Cores (threads)	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)

Cascade Lake-based Xeons

"Cascade Lake-SP" (14 nm) Scalable Performance

Support for up to 12 DIMMs of DDR4 memory per CPU socket
Xeon Platinum supports up to eight sockets; Xeon Gold supports up to four sockets; Xeon Silver and Bronze support up to two sockets
No suffix letter: up to 1.0TB DDR4 per socket
-M: Medium DDR memory tier support (up to 2.0TB)
-L: Large DDR memory tier support (up to 4.5TB)
-N: Network & NFV specialized
-T: High thermal-case and extended reliability
-Y: Speed select
-V: VM density value specialized
-S: Search value specialized
-U: Uniprocessor

Xeon Gold (uniprocessor)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Xeon Gold (dual processor)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

"Cascade Lake-AP" (14 nm) Advanced Performance

Support up to two sockets
2 dies per socket

Xeon Platinum (dual processor)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

"Cascade Lake-W" (14 nm)

Xeon W-22xx (uniprocessor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, FMA3, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Intel TSX-NI, Smart Cache, DL Boost.
PCI Express lanes: 48
Supports up to 8 DIMMs of DDR4 memory, maximum 1 ×TB.^[2]

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Xeon W-32xx (uniprocessor)

PCI Express lanes: 64
Supports up to 12 DIMMs of DDR4 memory, maximum 1 ×TB.
-M: Medium DDR memory tier support (up to 2 ×TB)

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Model number	sSpec number	Cores (threads)	Frequency	Turbo Boost all-core/2.0 (/max. 3.0)	L2 cache	L3 cache	TDP	Socket	I/O bus	Memory	Release date	Part number(s)	Release price (USD)

Ice Lake-based Xeons

"Ice Lake-SP" (10 nm) Scalable Performance

Support for up to 16 DIMMs of DDR4 memory per CPU socket
Support up to two sockets
Support up to 6.0TB DDR4 per socket
Support Speed Select - Base Frequency
-N: Network & NFV specialized
-T: High thermal-case and extended reliability
-Y/C: Speed Select - Performance Profile
-V: VM density value specialized
-S: 512GB SGX enclave
-U: Uniprocessor
-Q: Liquid Cooling Optimized

Related pages

List of Xeon microprocessors (45 to 22 nm)

References

[1] "Living on the Edge: Intel Launches Xeon D-2100 Series SoCs".

[2] "Intel Xeon W-2200 Family: Cascade Lake-X with ECC and 1TB Support".

[1]

[2]