TSMC

TSMC
Traditional Chinese	台灣積體電路製造股份有限公司
Transcriptions
Mandarin
- Hanyu Pinyin	Táiwān Jītǐ Diànlù Zhìzào Gǔfèn Yǒuxiàn Gōngsī
- Wade–Giles	T'ai2-wan1 Chi1-t'i3 Tien4-lu4 Chih4-tsao4 Ku3-fen4 You3-hsien4 Kung1-ssŭ1
- Bopomofo	ㄊㄞˊ ㄨㄢㄐㄧㄊㄧˇ ㄉㄧㄢˋ ㄌㄨˋ ㄓˋ ㄗㄠˋ ㄍㄨˇ ㄈㄣˋ ㄧㄡˇ ㄒㄧㄢˋ ㄍㄨㄥㄙ
Min
- Hokkien POJ	Tâi-oân chek-thé tiān-lō͘ chè-chō kó͘-hūn iú-hān kong-si
- Taiwanese; Romanization	Tâi-uân tsik-thé tiān-lōo tsè-tsō kóo-hūn iú-hān kong-si
Abbreviation
Traditional Chinese	台積電
Transcriptions
Mandarin
- Hanyu Pinyin	Tái Jī Diàn
- Wade–Giles	T'ai2 Chi1 Tien4
Min
- Hokkien POJ	Tâi-chek-tiān
- Taiwanese; Romanization	Tâi-tsik-tiān

Taiwan Semiconductor Manufacturing Company Limited
	TSMC R&D Center
Native name	台積電
Company type	Public
Traded as	REDIRECT Template:Taiwan Stock Exchange ; NYSE: TSM; LSE: OLCV; ;
Headquarters	Hsinchu Science Park, Hsinchu, Taiwan
Area served	Worldwide
Key people	C. C. Wei (president, chairman and CEO)
Production output	13 million 12-inch equivalent wafers (2024);
Services	Manufacture of integrated circuits; mask services; integrated circuit packaging; multi wafer foundry services;
Total equity	US$129.4 billion (2024)
Divisions	SSMC (38.8% joint venture with NXP)
Subsidiaries	TSMC Washington; TSMC Nanjing Company Ltd.; JASM;
TSMC
Traditional Chinese	台灣積體電路製造股份有限公司
Transcriptions
Mandarin
- Hanyu Pinyin	Táiwān Jītǐ Diànlù Zhìzào Gǔfèn Yǒuxiàn Gōngsī
- Wade–Giles	T'ai2-wan1 Chi1-t'i3 Tien4-lu4 Chih4-tsao4 Ku3-fen4 You3-hsien4 Kung1-ssŭ1
- Bopomofo	ㄊㄞˊ ㄨㄢㄐㄧㄊㄧˇ ㄉㄧㄢˋ ㄌㄨˋ ㄓˋ ㄗㄠˋ ㄍㄨˇ ㄈㄣˋ ㄧㄡˇ ㄒㄧㄢˋ ㄍㄨㄥㄙ
Min
- Hokkien POJ	Tâi-oân chek-thé tiān-lō͘ chè-chō kó͘-hūn iú-hān kong-si
- Taiwanese; Romanization	Tâi-uân tsik-thé tiān-lōo tsè-tsō kóo-hūn iú-hān kong-si
Abbreviation
Traditional Chinese	台積電
Transcriptions
Mandarin
- Hanyu Pinyin	Tái Jī Diàn
- Wade–Giles	T'ai2 Chi1 Tien4
Min
- Hokkien POJ	Tâi-chek-tiān
- Taiwanese; Romanization	Tâi-tsik-tiān
Website	tsmc.com
	Footnotes / references;

Taiwan Semiconductor Manufacturing Company Limited (TSMC) is a major Taiwanese semiconductor manufacturer that is used by Apple to manufacture its bionic chips and recently its Apple M5 series of chips. It also is used by Qualcomm, Huawei, Intel, Google Mediatek, AMD, and Nvidia for their series of chips.

TSMC Media

The Nvidia GeForce GTX 1070, which uses the GP104 die manufactured by TSMC on its 16 nm node
President Ma Ying-jeou with Morris Chang during his visit to Fab 15, 2015
Logo of European joint-venture with Bosch, Infineon and NXP in Germany.
熊本県にあるJASMの工場
Fab 21 under construction in Phoenix, Arizona in November 2023